Chip burnout in linear adapters is a complex issue that can be caused by multiple factors. One of the main reasons is over - current. When the load connected to the adapter exceeds its rated capacity for a long time, or there is a short - circuit fault in the circuit, the current flowing through the chip will increase significantly. The excessive current generates a large amount of heat, and if the chip's heat dissipation capacity cannot handle it, the temperature of the chip will rise rapidly, eventually leading to burnout.

　　Over - voltage is another important cause. Sudden voltage surges in the power grid, improper connection of the adapter to a high - voltage power source, or failures in the adapter's voltage regulation circuit can all cause the voltage applied to the chip to exceed its rated voltage. The chip's internal components are designed to work within a specific voltage range, and when this range is exceeded, the insulation between components may break down, resulting in short - circuits and ultimately burning out the chip.

　　In addition, poor heat dissipation conditions can also contribute to chip burnout. If the linear adapter is used in an environment with poor ventilation, or the heat - dissipation components (such as heat sinks) are not properly installed or have poor thermal conductivity, the heat generated by the chip during operation cannot be effectively dissipated. As the temperature of the chip keeps rising, its performance will decline, and eventually, it may be damaged due to overheating. Moreover, electrical interference from external sources, such as electromagnetic fields from nearby high - power electrical equipment, can disrupt the normal operation of the chip. In severe cases, this interference can cause abnormal current and voltage fluctuations inside the chip, leading to burnout.

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